IEEE Std P1730.1 D2, Jun 2023（IEEE Approved Draft Recommended Practice for Distributed Simulation Engineering and Execution Process Multi-Architecture Overlay (DMAO)）是电气电子工程师学会于 2023 年 6 月形成的草案。公开目录将其标为非现行（Inactive），主题领域包括 Computing and Processing、Components, Circuits, Devices and Systems[1]。参见IEEE 标准。
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IEEE Std P1730.1 D2, Jun 2023
IEEE Std P1730.1 D2, Jun 2023 是电气电子工程师学会的草案，题为“IEEE Approved Draft Recommended Practice for Distributed Simulation Engineering and Execution Process Multi-Architecture Overlay (DMAO)”；公开目录标为非现行（Inactive），著录年份为 2023 年。
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- IEEE Std P1730.1 D2, Jun 2023 — IEEE Xplore 题录 · IEEE
standard_number=P1730.1 D2, Jun 2023; status=Inactive; modifier=Draft
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