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IEEE Std P1838_D2.0, Aug 2019

IEEE Std P1838_D2.0, Aug 2019 是电气电子工程师学会的草案，题为“IEEE Draft Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits”；公开目录标为非现行（Inactive），著录年份为 2019 年。

Dikemas kini · rev 1 · Nama lain：P1838_D2.0, Aug 2019 P1838_D2.0, Aug 2019 - IEEE Draft Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits

IEEE Std P1838_D2.0, Aug 2019（IEEE Draft Standard for Test Access Architecture for Three-Dimensional Stacked Integrated Circuits）是电气电子工程师学会于 2019 年 8 月形成的草案。公开目录将其标为非现行（Inactive），主题领域包括 Components, Circuits, Devices and Systems、Power, Energy and Industry Applications[1]。参见IEEE 标准。

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  1. IEEE Std P1838_D2.0, Aug 2019 — IEEE Xplore 题录 · IEEE

    standard_number=P1838_D2.0, Aug 2019; status=Inactive; modifier=Draft

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  2. IEEE Xplore All Standards（KBART） · IEEE · 2026-11-01